Compact InP spot‐size converter with vertically tapered core layer formed by micro‐loading effect. Issue 12 (1st June 2017)

• Record Type: Journal Article
• Authors: Ueda, Y.; Ogiso, Y.; Kashio, N.; Hashizume, Y.; Kikuchi, N.; Ishikawa, M.; Kohtoku, M.
• Is Part Of: Electronics letters. Volume 53:Issue 12(2017)
• Page Start: 797
• Page End: 799
• Publication Date: 2017-06-01
• Subjects: convertors -- optical waveguides -- indium compounds -- III‐V semiconductors -- optical losses; compact spot‐size converter -- vertically tapered core layer -- microloading effect -- compact SSC -- wafer process -- vertical spot size -- InP waveguide -- coupling loss -- lensed fibre -- size 200 mum -- InP; Electronics -- Periodicals; 621.381
• DOI: 10.1049/el.2017.0711
• Languages: English
• ISSNs: 0013-5194

Abstract

Abstract : A compact (200 μm) spot‐size converter (SSC) with a vertically tapered core layer is developed, which is fabricated with a simple wafer process using the micro‐loading effect. It is confirmed that the vertical spot size of the SSC exceeded 2 μm, which was double that of the original waveguide. As a result, an InP waveguide integrated with the SSCs exhibited a coupling loss of <1 dB per facet for a lensed fibre with a 2.5 μm mode‐field diameter. The fluctuation in the total of coupling and excess losses of the SSC was <0.5 dB.