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3. Accurate lifetime prediction for channel hot carrier stress on sub-1 nm equivalent oxide thickness HK/MG nMOSFET with thin titanium nitride capping layer. (July 2016)

9. Device parameter optimization for sub-20 nm node HK/MG-last bulk FinFETs*Project supported by the National 02 IC Projects and the Opening Project of Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences. (April 2015)