1. A new hermetic sealing method for ceramic package using nanosilver sintering technology. (February 2018) Authors: Zhang, Hao; Liu, Yang; Wang, Lingen; Fan, Jiajie; Fan, Xuejun; Sun, Fenglian; Zhang, Guoqi Journal: Microelectronics and reliability Issue: Volume 81(2018) Page Start: 143 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Combined effect of Bi and Ni elements on the mechanical properties of low-Ag Cu/Sn-0.7Ag-0.5Cu/Cu solder joints. (April 2020) Authors: Kong, Xiangxia; Zhai, Junjun; Sun, Fenglian; Liu, Yang; Zhang, Hao Journal: Microelectronics and reliability Issue: Volume 107(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Cu3Sn-microporous copper composite joint for high-temperature die-attach applications. Issue 3 (4th October 2021) Authors: Pan, Zhen; Sun, Fenglian Journal: Soldering & surface mount technology Issue: Volume 34:Issue 3(2022) Page Start: 137 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Effect of Cu, Ag on the microstructure and IMC evolution of Sn5Sb–CuAgNi/Cu solder joints. (17th May 2019) Authors: Han, Bangyao; Sun, Fenglian; Ban, Gaofang; Liu, Yang; Liu, Yang; Li, Tianhui; Pang, Shushui Journal: Materials research express Issue: Volume 6:Number 8(2019) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Effect of nano-Cu addition on microstructure evolution of Sn0.7Ag0.5Cu-BiNi/Cu solder joint. Issue 2 (3rd April 2017) Authors: Ban, Gaofang; Sun, Fenglian; Liu, Yang; Cong, Shaonan Journal: Soldering & surface mount technology Issue: Volume 29:Issue 2(2017) Page Start: 92 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Effect of porous Cu addition on the microstructure and properties of Sn58Bi solder joints. (25th September 2019) Authors: Liu, Yang; Ren, Boqiao; Xu, Ruisheng; Zhang, Hao; Sun, Fenglian Journal: Materials research express Issue: Volume 6:Number 11(2019) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Effect of Sn/Cu thickness ratio on the transformation law of Cu6Sn5 to Cu3Sn in Sn/Cu interface during aging. (18th July 2018) Authors: Zuozhu, Yin; Sun, Fenglian; Guo, Mengjiao Journal: Materials research express Issue: Volume 5:Number 8(2018) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Effects of nano-copper particles on the properties of Sn58Bi composite solder pastes. Issue 1 (3rd January 2017) Authors: Zhang, Hao; Liu, Yang; Sun, Fenglian; Ban, Gaofang; Fan, Jiajie Journal: Microelectronics international Issue: Volume 34:Issue 1(2017) Page Start: 40 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Geometric size effect on IMC growth and elements diffusion in Cu/Sn/Cu solder joints. Issue 2 (3rd April 2017) Authors: Zhu, Yan; Sun, Fenglian Journal: Soldering & surface mount technology Issue: Volume 29:Issue 2(2017) Page Start: 85 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Growth kinetics of IMC at the solid Cu/liquid Sn interface. Issue 3 (14th February 2018) Authors: Yin, Zuozhu; Sun, Fenglian; Liu, Yang; Liu, Yang Journal: Soldering & surface mount technology Issue: Volume 30:Issue 3(2018) Page Start: 145 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗