Effects of nano-copper particles on the properties of Sn58Bi composite solder pastes. Issue 1 (3rd January 2017)

• Record Type: Journal Article
• Authors: Zhang, Hao; Liu, Yang; Sun, Fenglian; Ban, Gaofang; Fan, Jiajie
• Is Part Of: Microelectronics international. Volume 34:Issue 1(2017)
• Page Start: 40
• Page End: 44
• Publication Date: 2017-01-03
• Subjects: Porosity -- Mechanical stirring -- Nano-copper particles -- Sn58Bi composite solder paste; Microelectronics -- Periodicals; 621.381
• DOI: 10.1108/MI-02-2016-0013
• Languages: English
• ISSNs: 1356-5362

Abstract

Abstract : Purpose: This paper aimed to investigate the effects of nano-copper particles on the melting behaviors, wettability and defect formation mechanism of the Sn58Bi composite solder pastes. Design/methodology/approach: In this paper, the mechanical stirring method was used to get the nano-composite solder pastes. Findings: Experimental results indicated that the addition of 3 wt.% (weight percentage) 50 nm copper particles showed limited effects on the melting behaviors of the Sn58Bi composite solder paste. The spreading rate of the Sn58Bi composite solder paste showed a decreasing trend with the increase of the weight percentage of 50 nm copper particles from 0 to 3 wt.%. With the addition of copper particles of diameters 50 nm, 500 nm or 6.5 μm into the Sn58Bi solder paste, the porosities of the three types of solder pastes showed a similar trend. The porosity increased with the increase of the weight percentage of copper particles. Based on the experimental results, a model of the void formation mechanism was proposed. During reflow, the copper particles reacted with Sn in the matrix and formed intermetallic compounds, which gathered around the voids produced by the volatilization of flux. The exclusion of the voids was suppressed and eventually led to the formation of defects. Originality/value: This study provides an optimized material for the second and third level packaging. A model of the void formation mechanism was proposed.