Effect of nano-Cu addition on microstructure evolution of Sn0.7Ag0.5Cu-BiNi/Cu solder joint. Issue 2 (3rd April 2017)

• Record Type: Journal Article
• Authors: Ban, Gaofang; Sun, Fenglian; Liu, Yang; Cong, Shaonan
• Is Part Of: Soldering & surface mount technology. Volume 29:Issue 2(2017)
• Page Start: 92
• Page End: 98
• Publication Date: 2017-04-03
• Subjects: Intermetallic compounds -- Microstructure -- Copper -- Solder paste -- Composite materials; Brazing -- Periodicals; Solder and soldering -- Periodicals; 671.5605
• DOI: 10.1108/SSMT-06-2016-0013
• Languages: English
• ISSNs: 0954-0911

Abstract

Abstract : Purpose: The purpose of this paper is to focus on the fabrication of SnAgCu (SAC) nanocomposites solder and study the effect of Cu nanopowders (nano-Cu) addition on the microstructure evolution of resultant nanocomposite solder after reflow and thermal aging. Design/methodology/approach: Mechanical mixing is used in this work to incorporate nanoparticles into the solder and produce more homogeneous mixture. Standard metallographic procedures are applied for microstructural analysis of solder joints. Findings: It is found that nano-Cu doped into Sn0.7Ag0.5Cu-BiNi solder has no appreciable influence on melting temperature of the composite solder. The addition of Cu nanoparticles refines the microstructure of bulk solder and suppresses the growth of interfacial intermetallic compound (IMC) layers. However, interfacial IMC grain size increases slightly after 1.0 per cent nano-Cu added. Originality/value: The paper demonstrates a method of nano-composite solder paste preparation by means of mechanical mixing and a comparison study of the microstructure evolution of composite solder with the basic SAC solder.