1. (Invited) Pixel-Parallel 3-D Integrated CMOS Image Sensors for Next-Generation Video Systems. (10th April 2018) Authors: Goto, Masahide; Honda, Yuki; Watabe, Toshihisa; Hagiwara, Kei; Nanba, Masakazu; Iguchi, Yoshinori; Saraya, Takuya; Kobayashi, Masaharu; Higurashi, Eiji; Toshiyoshi, Hiroshi; Hiramoto, Toshiro Journal: ECS transactions Issue: Volume 85:Number 8(2018) Page Start: 163 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. (Invited) Pixel-Parallel CMOS Image Sensors with 16-Bit A/D Converters Developed by 3-D Integration of SOI Layers with Au/SiO2 Hybrid Bonding. (25th April 2016) Authors: Goto, Masahide; Hagiwara, Kei; Honda, Yuki; Nanba, Masakazu; Iguchi, Yoshinori; Saraya, Takuya; Kobayashi, Masaharu; Higurashi, Eiji; Toshiyoshi, Hiroshi; Hiramoto, Toshiro Journal: ECS transactions Issue: Volume 72:Number 3(2016) Page Start: 3 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Au / SiO2 Hybrid Bonding with 6-μm-Pitch Au Electrodes for 3D Structured Image Sensors. (24th August 2016) Authors: Honda, Yuki; Hagiwara, Kei; Goto, Masahide; Watabe, Toshihisa; Nanba, Masakazu; Iguchi, Yoshinori; Saraya, Takuya; Kobayashi, Masaharu; Toshiyoshi, Hiroshi; Higurashi, Eiji; Hiramoto, Toshiro Journal: ECS transactions Issue: Volume 75:Number 9(2016) Page Start: 103 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Fabrication of 3-Layer Stacked Pixel for Pixel-Parallel CMOS Image Sensors by Au/SiO2 Hybrid Bonding of SOI Wafers. (8th September 2020) Authors: Goto, Masahide; Nakatani, Naoki; Honda, Yuki; Watabe, Toshihisa; Nanba, Masakazu; Iguchi, Yoshinori; Saraya, Takuya; Kobayashi, Masaharu; Higurashi, Eiji; Toshiyoshi, Hiroshi; Hiramoto, Toshiro Journal: ECS transactions Issue: Volume 98:Number 4(2020) Page Start: 167 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Three-Layered Stacking Process by Au/SiO2 Hybrid Bonding for 3D Structured Image Sensors. (1st August 2017) Authors: Honda, Yuki; Goto, Masahide; Watabe, Toshihisa; Hagiwara, Kei; Nanba, Masakazu; Iguchi, Yoshinori; Saraya, Takuya; Kobayashi, Masaharu; Higurashi, Eiji; Toshiyoshi, Hiroshi; Hiramoto, Toshiro Journal: ECS transactions Issue: Volume 80:Number 4(2017) Page Start: 227 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗