Author/Creator: Croes, Kristof - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Croes, Kristof

1. A novel electromigration characterization method based on low-frequency noise measurements. (6th June 2019)

Authors:: Beyne, Sofie; Pedreira, Olalla Varela; Wolf, Ingrid De; Tőkei, Zsolt; Croes, Kristof
Journal:: Semiconductor science and technology
Issue:: Volume 34:Number 7(2019)
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Record Type:: Journal Article
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2. Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip–package interaction; a numerical investigation. (April 2016)

Authors:: Zahedmanesh, Houman; Gonzalez, Mario; Ciofi, Ivan; Croes, Kristof; Bömmels, Jürgen; Tőkei, Zsolt
Journal:: Microelectronics and reliability
Issue:: Volume 59(2016)
Page Start:: 102
Record Type:: Journal Article
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3. Effect of test structure on electromigration characteristics in three-dimensional through silicon via stacked devices. (17th April 2015)

Authors:: Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof
Journal:: Japanese journal of applied physics
Issue:: Volume 54:Number 5(2015:May)Supplement
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Record Type:: Journal Article
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4. Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking. (November 2019)

Authors:: Panchenko, Iuliana; Wolter, Klaus-Juergen; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Beyne, Eric; Wolf, M. Juergen
Journal:: Microelectronics and reliability
Issue:: Volume 102(2019)
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Record Type:: Journal Article
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5. Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. (January 2016)

Authors:: Ključar, Luka; González, Mario; De Wolf, Ingrid; Croes, Kristof; Bömmels, Jürgen; Tőkei, Zsolt
Journal:: Microelectronics and reliability
Issue:: Volume 56(2016)
Page Start:: 93
Record Type:: Journal Article
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6. Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. (January 2016)

Authors:: Ključar, Luka; González, Mario; De Wolf, Ingrid; Croes, Kristof; Bömmels, Jürgen; Tőkei, Zsolt
Journal:: Microelectronics and reliability
Issue:: Volume 56(2016)
Page Start:: 93
Record Type:: Journal Article
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7. Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. (December 2017)

Authors:: Ključar, Luka; González, Mario; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Murdoch, Gayle; Nolmans, Philip; De Vos, Joeri; Bömmels, Jürgen; Beyne, Eric; Tőkei, Zsolt
Journal:: Microelectronics and reliability
Issue:: Volume 79(2017)
Page Start:: 297
Record Type:: Journal Article
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8. Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling. Issue 5 (April 2015)

Authors:: Nabiollahi, Nabi; Moelans, Nele; Gonzalez, Mario; De Messemaeker, Joke; Wilson, Christopher J.; Croes, Kristof; Beyne, Eric; De Wolf, Ingrid
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 5(2015)
Page Start:: 765
Record Type:: Journal Article
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9. Modelling stress evolution and voiding in advanced copper nano-interconnects under thermal gradients. (August 2020)

Authors:: Zahedmanesh, Houman; Croes, Kristof
Journal:: Microelectronics and reliability
Issue:: Volume 111(2020)
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Record Type:: Journal Article
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