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APA Citation
Lian, S., Xu, C., Wang, J., Swart, H. C., & Terblans, J. J. (2021). grain boundary diffusion in bilayered Ag/Cu thin film under diffusion-induced and intrinsic stresses. Physica scripta, 96, . http://access.bl.uk/ark:/81055/vdc_100123124433.0x000061