Grain boundary diffusion in bilayered Ag/Cu thin film under diffusion-induced and intrinsic stresses. (8th March 2021)

• Record Type: Journal Article
• Authors: Lian, Songyou; Xu, Congkang; Wang, Jiangyong; Swart, Hendrik C; Terblans, Jacobus J
• Is Part Of: Physica scripta. Volume 96:Number 5(2021)
• Publication Date: 2021-03-08
• Subjects: diffusion -- grain boundary -- network -- intrinsic stress -- diffusion-induced stress; Physics -- Periodicals; 530.05
• DOI: 10.1088/1402-4896/abea32
• Languages: English
• ISSNs: 0031-8949

Abstract

Abstract: The influences of the diffusion-induced stress due to the difference in the radii of elements in an alloy and the intrinsic stress originating mainly from the surface or other kind of external stress, on the grain boundary diffusion are evaluated. A model for the grain boundary (GB) diffusion under stress is developed. The stress distributions are obtained for the cases that the free surface acts as a diffusion barrier or has a rapid surface diffusion. The average concentration depth profiles are simulated upon the change of the diffusion-induced stress, the intrinsic stress, the ratio of the volume diffusion coefficient to the grain boundary diffusion coefficient, and the diffusion time. The simulation results reveal that the tensile/compressive intrinsic stress hinder/enhance the grain boundary diffusion process. The developed model for the GB diffusion under stress is applied to the bilayered Ag/Cu film deposited on an inert substrate.