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HARVARD Citation
Lian, S. et al. (2021). Grain boundary diffusion in bilayered Ag/Cu thin film under diffusion-induced and intrinsic stresses. Physica scripta. p. . [Online].
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Lian, S. et al. (2021). Grain boundary diffusion in bilayered Ag/Cu thin film under diffusion-induced and intrinsic stresses. Physica scripta. p. . [Online].