Cite

MLA Citation

    Yuki Honda et al.. “Au / SiO2 Hybrid Bonding with 6-μm-Pitch Au Electrodes for 3D Structured Image Sensors.” ECS transactions, vol. 75, 2016, pp. 103–106. http://access.bl.uk/ark:/81055/vdc_100117129912.0x00001f
  
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