Cite
MLA Citation
Hongying He et al.. “Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging (Adv. Mater. 38/2022).” Advanced materials, vol. 34, no. 38, 2022, p. n/a. http://access.bl.uk/ark:/81055/vdc_100167021534.0x000045