Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging (Adv. Mater. 38/2022). Issue 38 (23rd September 2022)

• Record Type: Journal Article
• Authors: He, Hongying; Peng, Weixiang; Liu, Junbo; Chan, Xin Ying; Liu, Shike; Lu, Li; Le Ferrand, Hortense
• Is Part Of: Advanced materials. Volume 34:Issue 38(2022)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2022-09-23
• Subjects: boron nitride composites -- directional heat dissipation -- high thermal conductivity -- microstructure design -- platelet orientation; Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adma.202270266
• Languages: English
• ISSNs: 0935-9648

Abstract

Abstract : Heat Transfer In article number 2205120, Hortense Le Ferrand and co‐workers present a high‐thermal‐conductivity BN‐based composite with locally oriented microstructures that can conduct heat intentionally toward specific areas. The customizable heat‐transfer paths highlight a solution for thermal management of future 3D integrated electronics.