Cite
HARVARD Citation
Wei, Z. et al. (2022). Stress profile and crack evolution in a three-dimensional (3D) thermal barrier coatings during isothermal cyclic test. Ceramics international. 48 (20), pp. 30606-30620. [Online].
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Wei, Z. et al. (2022). Stress profile and crack evolution in a three-dimensional (3D) thermal barrier coatings during isothermal cyclic test. Ceramics international. 48 (20), pp. 30606-30620. [Online].