Cite
APA Citation
Wei, Z., Chai, Y., Yi, P., Meng, G., & Zhang, W. (2022). stress profile and crack evolution in a three-dimensional (3D) thermal barrier coatings during isothermal cyclic test. Ceramics international, 48(20), 30606–30620. http://access.bl.uk/ark:/81055/vdc_100161793121.0x00003f