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APA Citation
Van Nguyen, S., Hosadugra, S., Haigh, T., Yao, Y., Tai, L., Cohen, S., Shaw, T., Hu, C. K., Liniger, E., Virwani, K., Kellock, A. J., & Canaperi, D. (2017). low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect. ECS journal of solid state science and technology, 6, P429–P434. http://access.bl.uk/ark:/81055/vdc_100160138091.0x00000d