Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies. Issue 1 (14th October 2020)
- Record Type:
- Journal Article
- Title:
- Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies. Issue 1 (14th October 2020)
- Main Title:
- Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies
- Authors:
- Gao, Yang
Wang, Fuwei
Ding, Shaohu
Yang, Bin
Liu, Lin
Salmani, Mohammad - Abstract:
- Abstract : Purpose: This study aims to investigate the vibration effects on ball grid array lifetime. Design/methodology/approach: Several finite element method simulations and experiments were performed. Findings: An optimized circuit configuration was found. Originality/value: The originality of paper is confirmed by authors.
- Is Part Of:
- Soldering & surface mount technology. Volume 33:Issue 1(2021)
- Journal:
- Soldering & surface mount technology
- Issue:
- Volume 33:Issue 1(2021)
- Issue Display:
- Volume 33, Issue 1 (2021)
- Year:
- 2021
- Volume:
- 33
- Issue:
- 1
- Issue Sort Value:
- 2021-0033-0001-0000
- Page Start:
- 1
- Page End:
- 7
- Publication Date:
- 2020-10-14
- Subjects:
- Vibration -- Solder joints -- Fatigue -- Power spectral density -- Ball grid array (BGA)
Brazing -- Periodicals
Solder and soldering -- Periodicals
671.5605 - Journal URLs:
- http://www.emeraldinsight.com/journals.htm?issn=0954-0911 ↗
http://www.emeraldinsight.com/ ↗ - DOI:
- 10.1108/SSMT-05-2020-0020 ↗
- Languages:
- English
- ISSNs:
- 0954-0911
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 8327.242650
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 22343.xml