Cite
HARVARD Citation
Gao, Y. et al. (2021). Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies. Soldering & surface mount technology. 33 (1), pp. 1-7. [Online].
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Gao, Y. et al. (2021). Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies. Soldering & surface mount technology. 33 (1), pp. 1-7. [Online].