1. Preparation of PEG-rosin derivative for water soluble rosin flux. Issue 4 (5th September 2016) Authors: Phaphon, Kanlaya; Wacharasindhu, Sumrit; Petsom, Amorn Journal: Soldering & surface mount technology Issue: Volume 28:Issue 4(2016) Page Start: 188 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Investigation of soldering for crystalline silicon solar cells. Issue 4 (5th September 2016) Authors: Yang, Hong; Wang, He; Cao, Dingyue Journal: Soldering & surface mount technology Issue: Volume 28:Issue 4(2016) Page Start: 222 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Analytical and finite element methodology modeling of the thermal management of 3D IC with through silicon via. Issue 4 (5th September 2016) Authors: Wu, Mei-Ling; Lan, Jia-Shen Journal: Soldering & surface mount technology Issue: Volume 28:Issue 4(2016) Page Start: 177 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. IC solder joint inspection based on the Gaussian mixture model. Issue 4 (5th September 2016) Authors: Cai, Nian; Ye, Qian; Liu, Gen; Wang, Han; Yang, Zhijing Journal: Soldering & surface mount technology Issue: Volume 28:Issue 4(2016) Page Start: 207 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Simulating surface tension of Sn-based lead free solder using an artificial neural network. Issue 4 (5th September 2016) Authors: Wu, Min; Su, Xiangyu Journal: Soldering & surface mount technology Issue: Volume 28:Issue 4(2016) Page Start: 201 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Ni-P solder joints. Issue 4 (5th September 2016) Authors: Yan, Xingchen; Xu, Kexin; Wang, Junjie; Wei, Xicheng; Wang, Wurong Journal: Soldering & surface mount technology Issue: Volume 28:Issue 4(2016) Page Start: 215 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Solder joint inspection using eigensolder features. Issue 4 (3rd September 2018) Authors: Wu, Hao; Xu, Xiangrong Journal: Soldering & surface mount technology Issue: Volume 30:Issue 4(2018) Page Start: 227 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding. Issue 4 (2nd September 2019) Authors: Guo, Mengjiao; Sun, F.; Yin, Zuozhu Journal: Soldering & surface mount technology Issue: Volume 31:Issue 4(2019) Page Start: 227 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing. Issue 4 (2nd September 2019) Authors: Chen, Guang; Li, Jiqiang; Kuang, Xinwen; Wu, Yaofeng; Wu, Fengshun Journal: Soldering & surface mount technology Issue: Volume 31:Issue 4(2019) Page Start: 261 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles. Issue 4 (2nd September 2019) Authors: Zhang, Qiaoran; Zehri, Abdelhafid; Liu, Jiawen; Ke, Wei; Huang, Shirong; Latorre, Martí Gutierrez; Wang, Nan; Lu, Xiuzhen; Zhou, Cheng; Xia, Weijuan; Wu, Yanpei; Ye, Lilei; Liu, Johan Journal: Soldering & surface mount technology Issue: Volume 31:Issue 4(2019) Page Start: 193 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗