Cite
APA Citation
Huang, P., Fu, J., Lu, Y., Liu, J., Zhang, J., & Chen, D. (2022). an on-chip test structure to measure the Seebeck coefficient of thermopile sensors. Journal of micromechanics and microengineering, 32, . http://access.bl.uk/ark:/81055/vdc_100146770776.0x000051