An on-chip test structure to measure the Seebeck coefficient of thermopile sensors. (2nd December 2021)

• Record Type: Journal Article
• Authors: Huang, Peng; Fu, Jianyu; Lu, Yihong; Liu, Jinbiao; Zhang, Jian; Chen, Dapeng
• Is Part Of: Journal of micromechanics and microengineering. Volume 32:Number 1(2022)
• Publication Date: 2021-12-02
• Subjects: thermopile sensors -- Seebeck coefficient -- on-chip test structure; Microelectromechanical systems -- Periodicals; Micromechanics -- Periodicals; 621.38105
• DOI: 10.1088/1361-6439/ac3be1
• Languages: English
• ISSNs: 0960-1317

Abstract

Abstract: Thermopile sensors have a wide range of applications in consumer and industry. Seebeck coefficient is a basic thermal parameter of thermopile sensors. Extracting the Seebeck coefficient of both materials and thermocouple in thermopile sensors is of great importance. In this work, an on-chip test structure is designed. It consists of a substrate, a framework, supporting legs and a sensitive region which has a resistor serving as both heater and temperature detector. A set of on-chip test structures are fabricated along with a thermopile sensor. Its measurement results are analyzed and compared with apparatus measurement results. These results are consistent with each other, and the validity of structure is verified.