Numerical analysis and experimental tests for solder joints power cycling optimization. Issue 9 (August 2015)

• Record Type: Journal Article
• Authors: Cova, P.; Delmonte, N.; Chiozzi, D.
• Is Part Of: Microelectronics and reliability. Volume 55:Issue 9/10(2015)
• Page Start: 2036
• Page End: 2040
• Publication Date: 2015-08
• Subjects: Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2015.06.020
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Power cycling is the most realistic stress test for thermo-mechanical accelerated failure mechanisms in power devices. The fast evolution in solder materials and packaging techniques makes it necessary to find the proper accelerate test conditions for any specific package/mounting solution. This paper deals with a procedure for determining the power cycling optimal parameters (power rating, period, duty-cycle, cooling conditions) for accelerated stress tests on solder joints of SMD power devices mounted on a specific board. The procedure is based on FEM numerical analysis and preliminary experimental tests. Simulation results are presented; they are validated by comparison with measurements performed using an ad-hoc experimental setup. Early power cycling is also shown.