Cite
HARVARD Citation
Cova, P. et al. (2015). Numerical analysis and experimental tests for solder joints power cycling optimization. Microelectronics and reliability. 55 (9), pp. 2036-2040. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Cova, P. et al. (2015). Numerical analysis and experimental tests for solder joints power cycling optimization. Microelectronics and reliability. 55 (9), pp. 2036-2040. [Online].