Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules. (November 2020)

• Record Type: Journal Article
• Authors: Scognamillo, Ciro; Catalano, Antonio Pio; Lasserre, Philippe; Duchesne, Cyrille; d'Alessandro, Vincenzo; Castellazzi, Alberto
• Is Part Of: Microelectronics and reliability. Volume 114(2020)
• Publication Date: 2020-11
• Subjects: Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2020.113742
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: In this paper, an experimental and numerical study of the electrical ruggedness in double-sided cooled power modules is presented. In particular, the analysis focuses on the role of the spacing between substrates, which are commonly kept distant to avoid electrical failures like partial discharge and dielectric breakdown. To this aim, many double-sided cooled assemblies were manufactured and then tested by monitoring the leakage current due to high voltages applied to the terminals. Two failure mechanisms are recognized and characterized. To provide an explanation of the counterintuitive measurement outcomes, 3-D FEM electrostatic simulations were performed on the power module samples in the COMSOL Multiphysics environment.