Cite
MLA Citation
Tsung‐Chan Tsai et al.. “Copper film deposition using a helium dielectric barrier discharge jet.” Plasma processes and polymers, vol. 17, no. 11, 2020, p. n/a. http://access.bl.uk/ark:/81055/vdc_100113737599.0x00002d
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Tsung‐Chan Tsai et al.. “Copper film deposition using a helium dielectric barrier discharge jet.” Plasma processes and polymers, vol. 17, no. 11, 2020, p. n/a. http://access.bl.uk/ark:/81055/vdc_100113737599.0x00002d