Cite
HARVARD Citation
Tsai, T. et al. (2020). Copper film deposition using a helium dielectric barrier discharge jet. Plasma processes and polymers. 17 (11), p. n/a. [Online].
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Tsai, T. et al. (2020). Copper film deposition using a helium dielectric barrier discharge jet. Plasma processes and polymers. 17 (11), p. n/a. [Online].