Cite

MLA Citation

    Yejin Jo et al.. “3D Copper Circuits: Form‐Factor Free 3D Copper Circuits by Surface‐Conformal Direct Printing and Laser Writing (Adv. Funct. Mater. 45/2020).” Advanced functional materials, vol. 30, 2020, p. n/a. http://access.bl.uk/ark:/81055/vdc_100113604069.0x000014
  
Back to record