3D Copper Circuits: Form‐Factor Free 3D Copper Circuits by Surface‐Conformal Direct Printing and Laser Writing (Adv. Funct. Mater. 45/2020). (4th November 2020)

• Record Type: Journal Article
• Authors: Jo, Yejin; Park, Hye Jin; Kim, Young‐Bin; Lee, Sun Sook; Lee, Su Yeon; Kim, Sun‐Kyung; Choi, Youngmin; Jeong, Sunho
• Is Part Of: Advanced functional materials. Volume 30:Number 45(2020)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2020-11-04
• Subjects: 3D copper circuits -- 3D printing -- conformal -- laser writing; Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adfm.202070299
• Languages: English
• ISSNs: 1616-301X

Abstract

Abstract : In article number 2004659, Sun‐Kyung Kim, Youngmin Choi, Sunho Jeong, and co‐workers propose multi‐dimensional particles that allow for deep penetration of incident photons in the surface‐conformal laser writing process. Highly conductive 3D Cu features for form‐factor free electrical circuits are created simply via successive 3D printing and laser writing processes.