Lap shear test for solder materials: Local stress states and their effect on deformation and damage. (June 2020)
- Record Type:
- Journal Article
- Title:
- Lap shear test for solder materials: Local stress states and their effect on deformation and damage. (June 2020)
- Main Title:
- Lap shear test for solder materials: Local stress states and their effect on deformation and damage
- Authors:
- Siroky, Georg
Magnien, Julien
Melinc, David
Kozeschnik, Ernst
Kieslinger, Dietmar
Kraker, Elke
Ecker, Werner - Abstract:
- Abstract: This work presents a detailed analysis of stress states and different strain measures of two lap-shear sample designs. The stress- and strain distribution are discussed for both sample designs through numerical simulation. Additionally in-situ measurements of lap-shear experiments are performed to compare the large strain and damage behavior of the different sample designs. Despite the use of in-situ video-extensometer strain measurements, a deviation among elastic moduli from tensile- and lap-shear experiments is observed. Finite element analysis reveals that inhomogeneous strains due to boundary effects are the reason for the observed moduli deviation. A strain correction method is presented to correct video-extensometer measurements. The parameters of the correction function were obtained from numerical simulation and are provided for several sample dimensions. To illustrate the effectiveness of the proposed strain correction method, the correction function is applied to experimental lap-shear test data. The corrected shear moduli compare well with shear moduli calculated from tensile tests reported in literature. Graphical abstract: Unlabelled Image Highlights: Numerical study of local stresses and stress state in lap shear test Experimental investigation of deformation and damage Numerical investigation of strain measures in lap-shear test Correction method to obtain objective shear moduli
- Is Part Of:
- Microelectronics and reliability. Volume 109(2020)
- Journal:
- Microelectronics and reliability
- Issue:
- Volume 109(2020)
- Issue Display:
- Volume 109, Issue 2020 (2020)
- Year:
- 2020
- Volume:
- 109
- Issue:
- 2020
- Issue Sort Value:
- 2020-0109-2020-0000
- Page Start:
- Page End:
- Publication Date:
- 2020-06
- Subjects:
- Lap-shear test -- Solder material -- In-situ measurements -- Strain correction -- Finite element modeling -- Local stress analysis
Electronic apparatus and appliances -- Reliability -- Periodicals
Miniature electronic equipment -- Periodicals
Appareils électroniques -- Fiabilité -- Périodiques
Équipement électronique miniaturisé -- Périodiques
Electronic apparatus and appliances -- Reliability
Miniature electronic equipment
Periodicals
621.3815 - Journal URLs:
- http://www.sciencedirect.com/science/journal/00262714 ↗
http://www.elsevier.com/journals ↗
http://www.elsevier.com/homepage/elecserv.htt ↗ - DOI:
- 10.1016/j.microrel.2020.113655 ↗
- Languages:
- English
- ISSNs:
- 0026-2714
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5758.979000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 13418.xml