Cite
MLA Citation
P. Sideris et al.. “Inter-tier electrostatic coupling effects in 3D sequential integration devices and circuits.” Solid-state electronics, vol. 168, 2020, p. . http://access.bl.uk/ark:/81055/vdc_100104106241.0x000059
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P. Sideris et al.. “Inter-tier electrostatic coupling effects in 3D sequential integration devices and circuits.” Solid-state electronics, vol. 168, 2020, p. . http://access.bl.uk/ark:/81055/vdc_100104106241.0x000059