Cite
MLA Citation
M.H.H. Ishak et al.. “Effect of adhesive force on underfill process based on lattice Boltzmann method.” Microelectronics international, vol. 37, no. 1, 2020, pp. 54–63. http://access.bl.uk/ark:/81055/vdc_100102292314.0x000015
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M.H.H. Ishak et al.. “Effect of adhesive force on underfill process based on lattice Boltzmann method.” Microelectronics international, vol. 37, no. 1, 2020, pp. 54–63. http://access.bl.uk/ark:/81055/vdc_100102292314.0x000015