Effect of adhesive force on underfill process based on lattice Boltzmann method. Issue 1 (20th January 2020)

• Record Type: Journal Article
• Authors: Ishak, M.H.H.; Ismail, Farzad; Abdul Aziz, Mohd Sharizal; Abdullah, M.Z.
• Is Part Of: Microelectronics international. Volume 37:Issue 1(2020)
• Page Start: 54
• Page End: 63
• Publication Date: 2020-01-20
• Subjects: LBM -- Density ratio -- Adhesive force -- Underfill; Microelectronics -- Periodicals; 621.381
• DOI: 10.1108/MI-11-2018-0071
• Languages: English
• ISSNs: 1356-5362

Abstract

Abstract : Purpose: The purpose of this study is to investigate the effect of the adhesive force and density ratio using lattice Boltzmann method (LBM) during underfill process. Design/methodology/approach: To deal with complex flow in underfill process, a framework is proposed to improve the lattice Boltzmann equation. The fluid flows with different density ratio and bump arrangement in underfill are simulated by the incorporated Carnahan–Starling (CS) equation of state (EOS). The numerical study conducted by finite volume method (FVM) and experimental results are also presented in each case at the different filling percentage for verification and validation purpose. Findings: The numerical result is compared well with those acquired experimentally. Small discrepancy is detected in their flow profile. It was found that the adhesive force between fluid and solid was affected by the density ratio of the fluids and solder bump configuration. LBM has shown better adhesive force effect phenomenon on underfill process compared to FVM. LBM also demonstrated as a better tool to study the fluid flow in the underfill process. Practical implications: This study provides a basis and insights into the impact of adhesive force and density ratio to the underfill process that will be advancing the future design of flip chip package. This study also provides superior guidelines, and the knowledge of how adhesive force is affected by flip chip package structure. Originality/value: This study proposes the method to predict the adhesive force and density ratio effect for underfill flow in flip chip package. In addition, the proposed method has a good performance in representing the adhesive force during the underfill simulation for its natural physical basic. This study develops understanding of flow problems to attain high reliability for electronic assemblies.