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APA Citation
Simon, F., Letz, S., & Schletz, A. (2018). influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples via FE-simulation of power cycles. Microelectronics and reliability, 88, 1183–1188. http://access.bl.uk/ark:/81055/vdc_100069103764.0x00005d