Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples via FE-simulation of power cycles. (September 2018)

• Record Type: Journal Article
• Authors: Simon, F.B.; Letz, S.A.; Schletz, A.
• Is Part Of: Microelectronics and reliability. Volume 88/90(2018)
• Page Start: 1183
• Page End: 1188
• Publication Date: 2018-09
• Subjects: Thermo-mechanical simulation -- Finite element method -- Power cycling -- Lifetime -- Pulse length -- Sensitivity analysis; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2018.07.113
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: The lifetime of power electronics modules is most often determined via analytical models which use accelerated test results as input. These lifetime tests usually assume experience-derived largely conservative values for the load pulse length, (so-called ton times), which leads to time/resource-consuming trial-and-error calibration work. Another way of investigating the effect of the thermo-mechanical stress on the components is to use numerical models to simulate the aforementioned tests. This work analyses the influence of the temperature swing and of the load pulse length (ton ) on the lifetime of a representative sintered/soldered chip-on-substrate sample by means of the finite element method and sensitivity analysis. Highlights: Sintered interconnections are on their way to becoming the state-of-the-art for many electronics applications. Viscoplastic material models are needed to accurately describe the behavior of sintered/soldered interconnections via numerical simulation. ton and the power loss play the decisive roles for the lifetime of sinter and solder interconnections