Cite
APA Citation
Cornigli, D., Reggiani, S., Gnudi, A., Gnani, E., Baccarani, G., Fabiani, D., Varghese, D., Tuncer, E., Krishnan, S., & Nguyen, L. (2018). electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture. Microelectronics and reliability, 88, 752–755. http://access.bl.uk/ark:/81055/vdc_100069104230.0x000061