Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture. (September 2018)
- Record Type:
- Journal Article
- Title:
- Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture. (September 2018)
- Main Title:
- Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture
- Authors:
- Cornigli, D.
Reggiani, S.
Gnudi, A.
Gnani, E.
Baccarani, G.
Fabiani, D.
Varghese, D.
Tuncer, E.
Krishnan, S.
Nguyen, L. - Abstract:
- Abstract: The effects of moisture on the electrical properties of epoxy molding compounds containing high quantities of silica filler microparticles have been investigated by means of dielectric spectroscopy, steady-state conductivity and pulsed electro-acoustic space charge measurements. It has been shown that the presence of water at the filler/epoxy interfacial areas affects the low-frequency dielectric response of the materials and significantly increases their electrical conductivity, especially at higher temperatures. In addition, in presence of moisture, space charge measurements have shown the accumulation of heterocharges which significantly increase the electric field at the electrodes. These aspects are of primary importance, as the electrical properties of the encapsulation materials strongly influence the space charge distribution in high voltage devices. Highlights: Moisture absorption affects the electrical properties of epoxy molding compounds. The low-frequency dielectric response of materials is altered by the presence of water molecules. In wet specimens, the electrical conductivity is increased, especially at high temperatures. In presence of humidity, the accumulation of heterocharge near the electrodes has been observed.
- Is Part Of:
- Microelectronics and reliability. Volume 88/90(2018)
- Journal:
- Microelectronics and reliability
- Issue:
- Volume 88/90(2018)
- Issue Display:
- Volume 88/90, Issue 2018 (2018)
- Year:
- 2018
- Volume:
- 88/90
- Issue:
- 2018
- Issue Sort Value:
- 2018-NaN-2018-0000
- Page Start:
- 752
- Page End:
- 755
- Publication Date:
- 2018-09
- Subjects:
- Epoxy resin -- Dielectric spectroscopy
Electronic apparatus and appliances -- Reliability -- Periodicals
Miniature electronic equipment -- Periodicals
Appareils électroniques -- Fiabilité -- Périodiques
Équipement électronique miniaturisé -- Périodiques
Electronic apparatus and appliances -- Reliability
Miniature electronic equipment
Periodicals
621.3815 - Journal URLs:
- http://www.sciencedirect.com/science/journal/00262714 ↗
http://www.elsevier.com/journals ↗
http://www.elsevier.com/homepage/elecserv.htt ↗ - DOI:
- 10.1016/j.microrel.2018.07.030 ↗
- Languages:
- English
- ISSNs:
- 0026-2714
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5758.979000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 10945.xml