Cite
HARVARD Citation
Cornigli, D. et al. (2018). Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture. Microelectronics and reliability. pp. 752-755. [Online].
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Cornigli, D. et al. (2018). Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture. Microelectronics and reliability. pp. 752-755. [Online].