Ageing mechanisms in Deep Trench Termination (DT2) Diode. Issue 9 (August 2015)

• Record Type: Journal Article
• Authors: Baccar, F.; Arbess, H.; Theolier, L.; Azzopardi, S.; Woirgard, E.
• Is Part Of: Microelectronics and reliability. Volume 55:Issue 9/10(2015)
• Page Start: 1981
• Page End: 1987
• Publication Date: 2015-08
• Subjects: Deep Trench Termination -- Fixed charges -- Thermal ageing -- Failure analysis -- TCAD Senaturus; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2015.06.132
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Thermal cycling induces delamination and causes cyclic strains in a similar way to natural usage and weakens the normal functioning by thermal fatigue. Therefore, such approach can be conveniently used in accelerated testing of components to assess their reliability. The purpose of this work is to evaluate the reliability of DT 2 diode, by accelerated ageing process. Two major modes of failure were observed: the first one is the delamination of the chip and the second one concerns the breakdown voltage variation. Optical observations as well as Scanning Electron Microscopy (SEM) analysis have shown a delamination around the trench termination. Finite element simulations are carried out to explain the experimental results and justify the breakdown voltage variation.