3-D simulation study of single event effects of SiGe heterojunction bipolar transistor in extreme environment. Issue 8 (July 2015)
- Record Type:
- Journal Article
- Title:
- 3-D simulation study of single event effects of SiGe heterojunction bipolar transistor in extreme environment. Issue 8 (July 2015)
- Main Title:
- 3-D simulation study of single event effects of SiGe heterojunction bipolar transistor in extreme environment
- Authors:
- Zhang, Jin-xin
He, Chao-hui
Guo, Hong-xia
Tang, Du
Xiong, Cen
Li, Pei
Wang, Xin - Abstract:
- Highlights: This work performed a 3-D simulation of SEE for domestic SiGe HBT in extreme environment using TCAD tools. Current transient is very severe at low temperature caused by electric field at pn junction and change of mobility. The charge collection will be more sensitive at high temperature and high LET because ionized e-h pairs along ions track increase. Transient pulse caused by diffusion mechanism may have a serious effect on SEE. Abstract: A 3-D simulation of single event effects (SEEs) for domestic Silicon–Germanium heterojunction bipolar transistor (SiGe HBT) in extreme environment is performed with TCAD simulation tools. The influences of environment temperature and linear energy transfer (LET) on SEE are investigated. The combined effects of temperature and LET are also discussed. The results show some interesting phenomena by analyzing collected charges and transient current. The collected charges increase as temperature rises, but the current peaks decline with temperature increasing at base, collector and substrate. However, the peak of emitter transient current rises up and then declines. As LET rises, the collected charges go up linearly, and the transient current peaks also increase but their growth trends are slow. Mobility, carrier ionization and recombination of various regions at different conditions are the main causes of these differences. Current transient is very severe at low temperature. But charge collection is sensitive to high temperatureHighlights: This work performed a 3-D simulation of SEE for domestic SiGe HBT in extreme environment using TCAD tools. Current transient is very severe at low temperature caused by electric field at pn junction and change of mobility. The charge collection will be more sensitive at high temperature and high LET because ionized e-h pairs along ions track increase. Transient pulse caused by diffusion mechanism may have a serious effect on SEE. Abstract: A 3-D simulation of single event effects (SEEs) for domestic Silicon–Germanium heterojunction bipolar transistor (SiGe HBT) in extreme environment is performed with TCAD simulation tools. The influences of environment temperature and linear energy transfer (LET) on SEE are investigated. The combined effects of temperature and LET are also discussed. The results show some interesting phenomena by analyzing collected charges and transient current. The collected charges increase as temperature rises, but the current peaks decline with temperature increasing at base, collector and substrate. However, the peak of emitter transient current rises up and then declines. As LET rises, the collected charges go up linearly, and the transient current peaks also increase but their growth trends are slow. Mobility, carrier ionization and recombination of various regions at different conditions are the main causes of these differences. Current transient is very severe at low temperature. But charge collection is sensitive to high temperature and high LET. Transient pulse caused by diffusion mechanism may have a serious effect on SEEs. … (more)
- Is Part Of:
- Microelectronics and reliability. Volume 55:Issue 8(2015)
- Journal:
- Microelectronics and reliability
- Issue:
- Volume 55:Issue 8(2015)
- Issue Display:
- Volume 55, Issue 8 (2015)
- Year:
- 2015
- Volume:
- 55
- Issue:
- 8
- Issue Sort Value:
- 2015-0055-0008-0000
- Page Start:
- 1180
- Page End:
- 1186
- Publication Date:
- 2015-07
- Subjects:
- SiGe HBT -- Single event effects -- Extreme environment -- Different temperature -- LET -- 3-D simulation
Electronic apparatus and appliances -- Reliability -- Periodicals
Miniature electronic equipment -- Periodicals
Appareils électroniques -- Fiabilité -- Périodiques
Équipement électronique miniaturisé -- Périodiques
Electronic apparatus and appliances -- Reliability
Miniature electronic equipment
Periodicals
621.3815 - Journal URLs:
- http://www.sciencedirect.com/science/journal/00262714 ↗
http://www.elsevier.com/journals ↗
http://www.elsevier.com/homepage/elecserv.htt ↗ - DOI:
- 10.1016/j.microrel.2015.06.003 ↗
- Languages:
- English
- ISSNs:
- 0026-2714
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5758.979000
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- 8789.xml