Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. % W barrier film by nanoindentation. Issue 2 (7th April 2015)

• Record Type: Journal Article
• Authors: Chew, C.S.; Durairaj, R.; Haseeb, A. S. M. A.; Beake, B.
• Is Part Of: Soldering & surface mount technology. Volume 27:Issue 2(2015)
• Page Start: 90
• Page End: 94
• Publication Date: 2015-04-07
• Subjects: Intermetallic compounds -- Microstructure -- Reflow soldering -- Coatings; Brazing -- Periodicals; Solder and soldering -- Periodicals; 671.5605
• DOI: 10.1108/SSMT-01-2015-0001
• Languages: English
• ISSNs: 0954-0911

Abstract

Abstract : Purpose: – The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. % W alloy film by nanoindentation. It has been found that a ternary amorphous Sn-Ni-W layer formed below Ni3Sn4 IMC at the interface. In this study, mechanical properties of the IMC formed between SA solder and Ni-18 at. % W film after six times reflows were performed by nanoindentation. Design/methodology/approach: – The characterization was carried at 25°C, and 100 indents were generated. The elastic modulus and hardness were investigated. Findings: – The results showed that hardness of Ni3Sn4 IMC was higher than amorphous Sn-Ni-W phase. A slight bigger indent was observed on the Sn-Ni-W layer compared with that on the Ni3Sn4 IMC. Lower topographical height in the Sn-Ni-W layer indicated that the Sn-Ni-W phase was softer compared with the Ni3Sn4 IMC. The lower hardness and soft Sn-Ni-W phase is significantly related to the amorphous structure that formed through solid-state amorphization. Originality/value: – There are no publications about the indentation on the interfacial between the Ni-W layer and the Sn-Ag solder.