Cite
HARVARD Citation
Chew, C. et al. (2015). Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. % W barrier film by nanoindentation. Soldering & surface mount technology. 27 (2), pp. 90-94. [Online].
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Chew, C. et al. (2015). Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. % W barrier film by nanoindentation. Soldering & surface mount technology. 27 (2), pp. 90-94. [Online].