Cite
MLA Citation
Mohd Faizul Mohd Sabri et al.. “Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods.” Procedia technology, vol. 20, 2015, pp. 9–14. http://access.bl.uk/ark:/81055/vdc_100070984761.0x000001