Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods. (2015)

• Record Type: Journal Article
• Authors: Sabri, Mohd Faizul Mohd; Said, Suhana Binti Mohd; Shnawah, Dhafer Abdulameer
• Is Part Of: Procedia technology. Volume 20(2015)
• Page Start: 9
• Page End: 14
• Publication Date: 2015
• Subjects: Sn-1Ag-0.5Cu -- Al addition -- wetting balance method -- spread area method.; Technology -- Congresses; Technology -- Periodicals; Engineering -- Congresses; Engineering -- Periodicals; Engineering; Technology; Conference proceedings; Periodicals; 605
• DOI: 10.1016/j.protcy.2015.07.003
• Languages: English
• ISSNs: 2212-0173

Abstract

Abstract: In this work, we investigate the effects of 0.1 and 0.5 wt.% Al additions on the wettability of Sn-1Ag-0.5Cu solder on a Cu substrate. Spread area and wetting balance methods were used to evaluate the wettability of the solders. The results of both tests show that the addition of 0.1 wt.% Al does slightly improve the wetting properties of the Sn-1Ag-0.5Cu solder, whereas the addition of 0.5 wt.% Al worsens the wetting properties.