Cite
MLA Citation
A.S. Bahman et al.. “Mission-profile-based stress analysis of bond-wires in SiC power modules.” Microelectronics and reliability, vol. 64, 2016, pp. 419–424. http://access.bl.uk/ark:/81055/vdc_100041024841.0x00002a
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A.S. Bahman et al.. “Mission-profile-based stress analysis of bond-wires in SiC power modules.” Microelectronics and reliability, vol. 64, 2016, pp. 419–424. http://access.bl.uk/ark:/81055/vdc_100041024841.0x00002a