Mission-profile-based stress analysis of bond-wires in SiC power modules. (September 2016)

• Record Type: Journal Article
• Authors: Bahman, A.S.; Iannuzzo, F.; Blaabjerg, F.
• Is Part Of: Microelectronics and reliability. Volume 64(2016)
• Page Start: 419
• Page End: 424
• Publication Date: 2016-09
• Subjects: Bond-wire fatigue -- Electro-thermal model -- Thermo-mechanical model -- SiC Power Module -- Mission profile -- Reliability; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2016.07.102
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: This paper proposes a novel mission-profile-based reliability analysis approach for stress on bond wires in Silicon Carbide (SiC) MOSFET power modules using statistics and thermo-mechanical FEM analysis. In the proposed approach, both the operational and environmental thermal stresses are taken into account. The approach uses a two-dimension statistical analysis of the operating conditions in a real one-year mission profile sampled at time frames 5 min long. For every statistical bin corresponding to a given operating condition, the junction temperature evolution is estimated by a thermal network and the mechanical stress on bond wires is consequently extracted by finite-element simulations. In the final step, the considered mission profile is translated in a stress sequence to be used for Rainflow counting calculation and lifetime estimation. Highlights: A novel mission-profile-based reliability analysis approach for stress in SiC modules is proposed. In the approach, operational and environmental thermal stresses are taken into account. The fatigue-related bond-wire damage has been calculated by using Rainflow calculation. The proposed method is general and can be applied for fast reliability evaluation in real and complex mission profiles.