Review of recent progresses on flexible oxide semiconductor thin film transistors based on atomic layer deposition processes *Project supported by the National Research Foundation of Korea (NRF) (No. NRF-2017R1D1A1B03034035), the Ministry of Trade, Industry & Energy (No. #10051403), and the Korea Semiconductor Research Consortium. (January 2018)
- Record Type:
- Journal Article
- Title:
- Review of recent progresses on flexible oxide semiconductor thin film transistors based on atomic layer deposition processes *Project supported by the National Research Foundation of Korea (NRF) (No. NRF-2017R1D1A1B03034035), the Ministry of Trade, Industry & Energy (No. #10051403), and the Korea Semiconductor Research Consortium. (January 2018)
- Main Title:
- Review of recent progresses on flexible oxide semiconductor thin film transistors based on atomic layer deposition processes *Project supported by the National Research Foundation of Korea (NRF) (No. NRF-2017R1D1A1B03034035), the Ministry of Trade, Industry & Energy (No. #10051403), and the Korea Semiconductor Research Consortium.
- Authors:
- Sheng, Jiazhen
Han, Ki-Lim
Hong, TaeHyun
Choi, Wan-Ho
Park, Jin-Seong - Abstract:
- Abstract: The current article is a review of recent progress and major trends in the field of flexible oxide thin film transistors (TFTs), fabricating with atomic layer deposition (ALD) processes. The ALD process offers accurate controlling of film thickness and composition as well as ability of achieving excellent uniformity over large areas at relatively low temperatures. First, an introduction is provided on what is the definition of ALD, the difference among other vacuum deposition techniques, and the brief key factors of ALD on flexible devices. Second, considering functional layers in flexible oxide TFT, the ALD process on polymer substrates may improve device performances such as mobility and stability, adopting as buffer layers over the polymer substrate, gate insulators, and active layers. Third, this review consists of the evaluation methods of flexible oxide TFTs under various mechanical stress conditions. The bending radius and repetition cycles are mostly considering for conventional flexible devices. It summarizes how the device has been degraded/changed under various stress types (directions). The last part of this review suggests a potential of each ALD film, including the releasing stress, the optimization of TFT structure, and the enhancement of device performance. Thus, the functional ALD layers in flexible oxide TFTs offer great possibilities regarding anti-mechanical stress films, along with flexible display and information storage application fields.
- Is Part Of:
- Journal of semiconductors. Volume 39:Number 1(2018:Jan.)
- Journal:
- Journal of semiconductors
- Issue:
- Volume 39:Number 1(2018:Jan.)
- Issue Display:
- Volume 39, Issue 1 (2018)
- Year:
- 2018
- Volume:
- 39
- Issue:
- 1
- Issue Sort Value:
- 2018-0039-0001-0000
- Page Start:
- Page End:
- Publication Date:
- 2018-01
- Subjects:
- atomic layer deposition (ALD) -- oxide semiconductor -- thin film transistor -- flexible device -- mechanical stress
2560
Semiconductors -- Periodicals
621.38152 - Journal URLs:
- http://iopscience.iop.org/1674-4926/ ↗
http://www.iop.org/EJ/journal/jos ↗
http://www.iop.org/ ↗ - DOI:
- 10.1088/1674-4926/39/1/011008 ↗
- Languages:
- English
- ISSNs:
- 1674-4926
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - BLDSS-3PM
British Library STI - ELD Digital store - Ingest File:
- 6734.xml