Cite
MLA Citation
Mei-Ling Wu and Jia-Shen Lan. “Analytical and finite element methodology modeling of the thermal management of 3D IC with through silicon via.” Soldering & surface mount technology, vol. 28, no. 4, 2016, pp. 177–187. http://access.bl.uk/ark:/81055/vdc_100039856485.0x00003c