Cite
HARVARD Citation
Wu, M. et al. (2016). Analytical and finite element methodology modeling of the thermal management of 3D IC with through silicon via. Soldering & surface mount technology. 28 (4), pp. 177-187. [Online].
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Wu, M. et al. (2016). Analytical and finite element methodology modeling of the thermal management of 3D IC with through silicon via. Soldering & surface mount technology. 28 (4), pp. 177-187. [Online].