Advanced thermal simulation of SiGe:C HBTs including back-end-of-line. (December 2016)
- Record Type:
- Journal Article
- Title:
- Advanced thermal simulation of SiGe:C HBTs including back-end-of-line. (December 2016)
- Main Title:
- Advanced thermal simulation of SiGe:C HBTs including back-end-of-line
- Authors:
- d'Alessandro, Vincenzo
Magnani, Alessandro
Codecasa, Lorenzo
Rinaldi, Niccolò
Aufinger, Klaus - Abstract:
- Abstract: Advanced 3-D thermal simulations of state-of-the-art SiGe:C HBTs are performed, which ensure improved accuracy with respect to conventional approaches. The whole back-end-of-line architecture is modeled so as to account for the cooling effect due to the upward heat flow. Moreover, a nonuniform power density is considered to describe the heat source, and thermal conductivity degradation effects due to germanium, doping profile, and phonon scattering in narrow layers are implemented. The numerical thermal resistances are compared with those experimentally evaluated by means of a robust technique relying on the temperature dependence of the base-emitter voltage. Highlights: Accurate 3-D thermal simulations of SiGe:C HBTs including the BEOL are performed. A realistic nonuniform power density obtained by device simulation is considered. Thermal conductivity degradation due to Ge, doping, scattering with edges is included. FEM thermal resistances are compared with those measured by an improved dc technique. The individual contribution of all effects on the heat propagation is quantified.
- Is Part Of:
- Microelectronics and reliability. Volume 67(2016)
- Journal:
- Microelectronics and reliability
- Issue:
- Volume 67(2016)
- Issue Display:
- Volume 67, Issue 2016 (2016)
- Year:
- 2016
- Volume:
- 67
- Issue:
- 2016
- Issue Sort Value:
- 2016-0067-2016-0000
- Page Start:
- 38
- Page End:
- 45
- Publication Date:
- 2016-12
- Subjects:
- Back-end-of-line (BEOL) -- Finite element method (FEM) -- Heterojunction bipolar transistor (HBT) -- Self-heating (SH) -- Silicon germanium (SiGe) -- Thermal resistance
Electronic apparatus and appliances -- Reliability -- Periodicals
Miniature electronic equipment -- Periodicals
Appareils électroniques -- Fiabilité -- Périodiques
Équipement électronique miniaturisé -- Périodiques
Electronic apparatus and appliances -- Reliability
Miniature electronic equipment
Periodicals
621.3815 - Journal URLs:
- http://www.sciencedirect.com/science/journal/00262714 ↗
http://www.elsevier.com/journals ↗
http://www.elsevier.com/homepage/elecserv.htt ↗ - DOI:
- 10.1016/j.microrel.2016.06.005 ↗
- Languages:
- English
- ISSNs:
- 0026-2714
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5758.979000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 1808.xml