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APA Citation
Lee, H., Hong, D., Choi, J. Y., Kim, J. Y., Lee, S. H., Kim, H. M., Yang, S. H., & Choi, I. S. (n.d.). back Cover: Layer‐by‐Layer‐Based Silica Encapsulation of Individual Yeast with Thickness Control (Chem. Asian J. 1/2015). Chemistry, an Asian journal, 10(1), 264. http://access.bl.uk/ark:/81055/vdc_100025009662.0x000022